BGA Solder Paste
Perfect for other circuitry reworking and repair, removing and replacing EMMC Chips etc.
Size 35g
BGA Solder Paste
Perfect for EMMC chip change
Perfect for other circuitry reworking and repair
Joint high intensity
Good immersion
Good insulating ability
Soldering paste for cell phone PCB and SMD like BGA, PGA, etc.
Help to repair the circuit boards and protect the electronic components
A necessary material for repairing the mobile phone mainboard
Size 35g
-
Brandfonefunshop
-
Compatible BrandUniversal
-
Modelwk-030g
-
Model Numberwk-030g
-
Country/Region of ManufactureChina
-
Manufacturer warranty3 Months from date of purchase
-
Weight0.03kg
-
Number of Pieces1
-
Unit Quantity1
-
Unit TypeUnit
-
Year Manufactured2021
-
Dispatches FromUnited Kingdom
-
Supported DevicesUniversal
-
QTYYes
-
Custom InfoUniversal
