Specially designed heat-resistant repair board: Enables secure placement of iPhone 7 and 7 Plus logic boards during heat-intensive repair tasks.

Facilitates IC removal and reworking: Provides a stable platform for intricate heat-related procedures without compromising the integrity of the logic board.

Ensures safety and precision: Minimizes the risk of damage to delicate components by securely holding the logic board in place throughout the repair process.

Compatible with iPhone 7 and 7 Plus models: Tailored specifically for these devices, ensuring a precise fit and optimal functionality during repairs.

Enhances efficiency and effectiveness: Streamlines repair procedures by offering a reliable solution for managing heat-sensitive tasks, ultimately saving time and improving outcomes.