Previous image
Reballing Stencil For MSM 8992A 8976A 8996A Qualcom CPU Mijing BGA qu1
Next image
Zoom image

Reballing Stencil For MSM 8992A 8976A 8996A Qualcom CPU Mijing BGA qu1

✅HIGH PRECISION-MIJING BGA Stencil is a High Precision BGA Reballing Template
✅COMPATABILITY-Compatible with MSM 8992A/8976A/8996A, Qualcom CPU.
✅HEAT-Can be used with direct heat.
✅REQUIRED TOOL-This is a required tool for reballing ic's.
✅SMALL AND STRONG-This product is small and strong.

  • £4.99
Qty:  
In stock (6 items available)

MIJING BGA Stencil is a High Precision BGA Reballing Template for MSM 8992A/8976A/8996A, Qualcom CPU and can be used with direct heat. This is a required tool for reballing ic's onMSM 8992A/8976A/8996A, Qualcom CPU.

    • Weight
      0.03 kg
    • SKU
      mijingsten-qu1
  • Brand
    Mijing
  • Type
    Reballing Stencil
  • Compatible Model
    For MSM 8992A
  • Material
    Metal
  • Compatible Brand
    For Qualcomm CPU
  • Colour
    Silver
  • Model
    mijingsten-qu1
  • Model Number
    mijingsten-qu1
  • Country/Region of Manufacture
    China
  • Manufacturer warranty
    3 Months from date of purchase
  • Weight
    0.03kg
  • Number of Pieces
    1
  • Unit Quantity
    1
  • Unit Type
    Unit
  • Year Manufactured
    2023
  • Dispatches From
    United Kingdom
  • Supported Devices
    For Qualcomm CPU
  • QTY
    Yes