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Reballing Stencil For iPhone 13 Series Mijing T3D A15 3D NAND BGA IC Chip
QUALITY - This reballing stencil is made from the finest materials to ensure its up to the job. Ultra-thin 0.12mm design with better application of solder paste tinning, continuous bending, and very tough.
USAGE - Needed to reball the IC Chips of the iPhone 13, 13 Pro, 13 Pro Max and 13 mini.
COMPATIBILITY - For use with iPhone 13 iPhone 13 Pro, iPhone 13 Pro Max, iPhone 13 Mini Only. Round square precise hole position, making steel mesh more durable, more off-grid, more efficient.
REQUIRED TOOL - This is a required tool for reballing ic's.
SMALL AND STRONG - This product is small and strong.
QUALITY - This reballing stencil is made from the finest materials to ensure its up to the job. Ultra-thin 0.12mm design with better application of solder paste tinning, continuous bending, and very tough.
USAGE - Needed to reball the IC Chips of the iPhone 13, 13 Pro, 13 Pro Max and 13 mini.
COMPATIBILITY - For use with iPhone 13 iPhone 13 Pro, iPhone 13 Pro Max, iPhone 13 Mini Only. Round square precise hole position, making steel mesh more durable, more off-grid, more efficient.
REQUIRED TOOL - This is a required tool for reballing ic's.
SMALL AND STRONG - This product is small and strong.
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Brandfonefunshop
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Typealuminium metal plate
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Compatible ModelFor iPhone
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MaterialAluminium
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Compatible BrandFor Apple
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ColourSivler
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Modelmjstenip133d
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Model Numbermjstenip133d
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Length15cm
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Width10cm
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Country/Region of ManufactureChina
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Manufacturer warranty3 Months from date of purchase
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Weight0.03kg
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depth0.1cm
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Height0.1cm
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Number of Pieces1
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Unit Quantity1
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Unit TypeUnit
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Year Manufactured2023
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Dispatches FromUnited Kingdom
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Supported DevicesFor Apple
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QTYYes
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Custom InfoFor Apple