This newer 3-in-1 complete Conduction Heating system can be used to heat and separate the logic boards on iPhone X Range.

The special layout of the 3-in-1 heat mold only allows the section holding the 2 logic boards together to heat, so this is good for preventing heat transfer to parts not needed for separation.

1 Mold supports iPhone X, iPhone XS and iPhone XS Max

Video

How To Use

To separate the two parts of the logic board on iPhone x , iPhone Xs, iPhone Xs Max we use 185-degrees temperature

Simply clip in the logic board using the fixing arm on the lower section, switch on heat and wait until 2-4 minutes until temperature has been reached, then you can begin to separate.

Specifications

Power Input: AC110-230V, 50/60Hz, 5A

Rated Power: 70W

Temperature Range: 80 - 280 Degrees Celsius

Complete Package Contents:

Main Heating Controller Base (T12A)

3-in1 Logic Board Separation Heat Plate For iPhone X, Xs and XS Max